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RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

Categories Rigid Flex PCB
Brand Name: XCE
Model Number: XCE Bh788
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: MOQ 1 Piece
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
Delivery Time: 5-10 working days
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color: Green
Material: FR4
Layer: 4
Board Size: 7*6cm
Copper Thinknes: 1 oz
Min Line Width: 4 mil
Min Line Space: 4mil
Surface Finish: Immersion Tin
Name: FR4 PCB
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RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask


RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask


Quick Detail :
1. Type : Pcb
2. Material : FR4
3. Layer : Multilayer
4. Products Size: 7*6cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin


Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,Cooper Base,high frequency material,Rogers,Taconic,Isola,F4B,Arlon

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

Data :

Layer1 to 28 layers
Material typeFR-4,Rogers,Taconic,Isola,F4B
Board thickness0.21mm to 7.0mm
Copper thickness0.5 OZ to 7.0 OZ
Copper thickness in hole>25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance


Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
CertificateUL, ISO 9001, ISO 14001
Special requirementsBuried and blind vias+controlled impedance +BGA
ProfilingPunching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


Production Description :

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s


Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:01
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:1c


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Product Tags:

custom-made pcb

  

custom pcb

  
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